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| Preliminary Data Sheet PD-20994 rev. A 06/01 FD200H02A5B Fred Die in Wafer Form a c 0.35 0.01 (0.014 0.0004) NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). C b d A 2. CONTROLLING DIMENSION (INCH): 3. DIMENSIONS AND TOLERANCES: a = 5.080 0.05 (0.200 0.002) b = 5.08 0.05 (0.200 0.002) c = 4.420 0.003 (0.174 0.0001) d = 4.420 0.003 (0.174 0.0001) 4. LETTER DESIGNATION: A = Anode (Top Metal) C = Cathode (Back Metal) 5. SAWING: Recommended Blade SEMITEC S1025 QS00 Blade 6. MINIMUM ORDER QUANTITY: 300 die 40 (1.57) Wafer flat alligned with side b of the die O 125 (4.92) NOT TO SCALE www.irf.com 1 FD200H02A5B Preliminary Data Sheet PD-20994 rev. A 06/01 Electrical Characteristics (Wafer Form) Parameters VFM VFM VRRM IRM trr Maximum Forward Voltage Maximum Forward Voltage Mimunum Reverse Breakdown Voltage Max. Reverse Leakage Current Typ. Reverse Recovery Time Units 1.13 V 1.08 V 200 V 50 A 35 ns Test Conditions TJ = 25C, I F = 150 A TJ = 25C, I F = 60 A TJ = 25C, I RRM = 100 A TJ = 25C, V RRM = 200 V I F = 1A, di/ dt = 100A/s, V R = 30 V (PowIRtab) (TO-247) Mechanical Data Nominal Back Metal Composition, Thickness Nominal Front Metal Composition, Thickness Chip Dimensions Reject Ink Dot Size Recommended Storage Environment Cr - Ni - Ag (1 KA - 2 KA - 3 KA) 99% Al, 1% Si (3 microns) 0.200" x 0.200" (see drawing) 0.25 mm diameter minimum Storage in original container, in dessicated nitrogen, with no contamination Ordering Information Table Device Code FD 1 1 2 3 4 5 6 7 Fred Die 200 2 H 3 02 4 A 5 5 6 B 7 Chip Dimension in Mils: Process Voltage code Vrrm (*100) eg: Chip surface metallization: Wafer diameter in inches Packaging: 200 = 200x200 square H = HyperFast 02 = 200V A = Aluminium (anode), Silver (cathode) B = Inked Probed Unsawn Wafer (Wafer in box) 2 www.irf.com |
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